Senior Member of Technical Staff, Thin Films Engineer
Intel
Opportunity published from Workday · applications stay with the original hiring source.
About this opportunity
About the opportunity: Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a senior technical leader driving process innovation across Intel's most advanced semiconductor technologies in volume manufacturing.
You will spearhead the development, optimization, and manufacturability of critical thin film deposition processes, ensuring seamless transitions from early development to high-volume production while meeting Intel foundry customer requirements.
Operating at the nexus of Technology Development and High-Volume Manufacturing, you will drive breakthrough solutions for Intel 18A, Intel 3, 12nm, and next-generation technology nodes.
This high-visibility position directly impacts Intel's foundry competitiveness and customer success.
Key responsibilities
- Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules.
- Drive defectivity reduction and uniformity improvements through systematic process enhancement.
- Lead technical problem resolution and deliver solutions that meet aggressive technology node targets.
- Optimize equipment performance working with internal teams and key suppliers.
- Align technical vision with customer requirements and business objectives.
- Synthesize complex technical data to formulate and execute strategic responses.
- Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines.
- Collaborate closely with Technology Development, High Volume Manufacturing, and Business Groups.
Qualifications
- Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field.
- 5+ years semiconductor industry experience with strong focus on thin film deposition processes.
- Proven experience in process development, technical leadership, and manufacturing engineering.
- Experience working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimization.
- Fab startup experience across manufacturing, quality, R and D, and supply chain functions.
- Experience with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems.
Nice to have
- Ph.D. in Electrical/ Mechanical or Chemical Engineering, Materials Science, or in a STEM related field with research publications and patent portfolio in thin film technologies.
- Experience in Gate All Around (GAA) logic technologies within semiconductor foundry environments.
- Experience delivering customized solutions across Technology Development and HVM organizations.
- Cross-functional leadership experience managing diverse stakeholder groups.
- Semiconductor foundry experience.
Benefits
- Competitive pay and stock bonuses.
- Comprehensive benefit programs including health, retirement, and vacation.
Annual Salary Range
- $155,520.00-298,440.00 USD.
Job Type
Experienced Hire.
- Shift: Shift 1 (United States of America).
Primary Location
US, Oregon, Hillsboro.
Additional Locations
US, Arizona, Phoenix.
Work Model
Hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.
About the company: Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM).
We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes and process capability from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers.
Application: UpVagas lists this opportunity from the hiring company or its recruitment platform. The application is completed at the original source.
