Packaging Module Development Engineer
Intel
Opportunity published from Workday · applications stay with the original hiring source.
About the opportunity
The Advanced Packaging Technology and Manufacturing (APTM) organization is seeking a Metrology Equipment Engineer to drive process control, manufacturing data analytics, and yield improvement for Thermal Compression Bonding (TCB) technologies.
The successful candidate develops and sustains metrology systems, measurement methods, and inspection equipment to support Intel's roadmap for advanced packaging and Thermal Compression Bonding technologies, applying engineering principles to improve process control, product quality, reliability, productivity, yield, and manufacturability.
Key responsibilities
- Optimizes metrology capability across laboratory and manufacturing environments by developing and qualifying measurement processes, equipment specifications, calibration methods, and correlation techniques.
- Uses design of experiments, statistical analysis, and measurement system analysis to improve repeatability, reproducibility, and consistency across tools, sites, and product generations, documenting findings through white papers, reports, and qualification summaries.
- Establishes measurement specifications and collaborates with equipment suppliers, internal development teams, quality, process, and manufacturing organizations to ensure measurement capability, traceability, and data integrity meet program needs.
- Provides technical consultation on measurement challenges, equipment issues, lab-to-factory correlation, and metrology process improvements.
- Supports standardization of metrology methods, working closely with packaging technology development, process engineering, and partner engineering groups to assess readiness and meet product milestones.
- Applies strong analytical, problem-solving, communication, and collaboration skills to lead complex technical initiatives with high ownership and execution focus.
Qualifications
- Bachelor's degree in Electrical Engineering, Mechanical Engineering, Physics, Metrology, Instrumentation, Optical Engineering, or a related engineering discipline with 4+ years of experience, a Master's degree with 3+ years of experience, or a PhD with 1+ years of educational or work experience.
- Experience in metrology systems development, measurement equipment qualification, calibration, and/or measurement method development in a manufacturing, lab, or engineering environment.
- Measurement system analysis (MSA), including bias, linearity, stability, repeatability, and reproducibility.
- Experience with electrical measurements and test, such as continuity, resistance, leakage, signal integrity basics, or related parametric test methods.
- Experience with optical metrology, including microscopes, imaging systems, inspection methods, and/or machine vision.
- Data analysis tools such as Python, Excel, SQL, or similar tools for measurement analysis and reporting.
Nice to have
- Experience in semiconductor manufacturing, preferably in advanced packaging and developing or sustaining metrology systems for process control, product qualification, or reliability evaluation.
- Strong background in equipment selection, tool qualification, acceptance testing, calibration traceability, and working with suppliers, vendors, or external calibration service providers.
- Experience with machine vision systems, automated inspection, camera-based measurement techniques, lab-to-factory correlation, tool matching, and cross-tool measurement agreement studies.
- Experience with DOE, correlation analysis, and method optimization for metrology or test systems, along with knowledge of quality systems, measurement documentation, and standardization of metrology methods.
- Demonstrated ability to analyze measurement data using statistical methods to identify variation, correlation issues, tool drift, and root causes.
Benefits
- Complete and competitive package of benefits for employees and their families through every stage of life.
- Total compensation package including competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
Job Type
Experienced Hire
- Shift: Shift 1 (United States of America)
Primary Location
US, Arizona, Phoenix
Annual Salary Range
- $115,110.00-219,550.00 USD
Work Model
On-site presence required
About the company
Intel Corporation is a leading technology company focused on developing breakthrough packaging technologies that power the world's most advanced computing products.
Employees work alongside industry-leading experts to solve challenging technical problems and directly influence the future of semiconductor manufacturing.
Additional information
- For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information.
- Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices and never charges any fees during the hiring process.
Application: UpVagas lists this opportunity from the hiring company or its recruitment platform. The application is completed at the original source.
