Packaging Module Equipment Development Engineer
Intel
Opportunity published from Workday · applications stay with the original hiring source.
About the opportunity
Join Intel's Packaging Module Development team and play a pivotal role in pioneering assembly packaging technologies that drive Intel's future advancements.
As a Packaging Module Development Engineer, you will develop innovative processes and refine equipment to enable next-generation packaging solutions and enhance US-based manufacturing.
Your contributions will directly impact manufacturing efficiency, product reliability, and technological innovation in the global semiconductor industry.
This role requires an on-site presence based in Phoenix, Arizona.
Key responsibilities
- Develop and optimize assembly processes and equipment to meet quality, reliability, cost, yield, productivity, and manufacturability goals.
- Apply Design of Experiments (DOE) principles and statistical methods to refine processes, specifications, and equipment capabilities, documenting findings through technical reports.
- Ensure manufacturability of physical layouts in package designs and oversee manufacturing equipment health and long-term reliability from development through high volume manufacturing.
- Support the integration of new materials and architectures into equipment for advanced foundry customer product manufacturability.
- Innovate new techniques, tools, and quality screens to proactively identify and address equipment health and reliability issues.
- Lead problem-solving initiatives, continuous improvement efforts, and standardization of equipment qualification practices.
Qualifications
- US Citizenship is required.
- Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience; OR Master's degree in the same fields with 1+ years of experience; OR a PhD in the same fields.
- Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
Nice to have
- Demonstrated ability to lead technical innovation and manage complex, time-sensitive projects.
- Experience with high-volume manufacturing, including equipment troubleshooting and change qualification.
- Understanding of semiconductor fabrication processes and packaging technologies.
- Familiarity with equipment installation and qualification.
- Experience with the optimization of procedures or design for safety, quality, and cost-effective manufacturability.
Benefits
- Competitive annual salary range of $99,030.00 to $188,890.00 USD.
- Stock bonuses.
- Comprehensive health benefit programs.
- Retirement programs.
- Paid vacation.
Job Type
Experienced Hire
- Shift: Shift 1 (United States of America)
Primary Location
US, Arizona, Phoenix
Work Model
On-site presence required
Work Authorization
US Citizenship required
About the company
Intel is a company of bold and curious inventors and problem solvers who create astounding technology advancements and experiences.
With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse teams search for tomorrow's technology.
We work every single day to design and manufacture silicon products that empower people's digital lives.
Application: UpVagas lists this opportunity from the hiring company or its recruitment platform. The application is completed at the original source.
