Semiconductor Packaging Process Engineering Lead
Intel
Opportunity published from Workday · applications stay with the original hiring source.
About the opportunity
Intel Corporation is a global leader in the semiconductor industry, engineering foundational technologies that power modern computing.
Within Intel, the Epoxy Mold Module division plays a pivotal role in developing and scaling world-class semiconductor packaging solutions.
By advancing next-generation assembly processes and driving operational excellence, our group directly enables Intel's product roadmap and delivers innovative, high-quality products to customers worldwide.
We are seeking a visionary Packaging Module Development Manager to lead our engineering team in Arizona.
Key responsibilities
- Lead, mentor, and develop a team of engineers across a 24x7 operation, cultivating technical expertise, clear goal alignment, and differentiated execution.
- Guide the deployment, implementation, and optimization of new packaging equipment and process technologies into the manufacturing environment.
- Direct equipment and process specifications to guarantee strict alignment with operational goals and manufacturing expectations.
- Manage shift engineering coverage and build strong partnerships across manufacturing, automation, and partner engineering groups.
- Formulate long-term strategies that advance manufacturing efficiency, yield, throughput, and overall process manufacturability while championing a quality-first culture.
Qualifications
- Bachelor's Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics, or a related STEM field AND 6+ years of professional experience in engineering or manufacturing; OR Master's Degree in the above fields AND 4+ years of professional experience; OR PhD in the above fields AND 2+…
- Relevant experience in developing, qualification testing, or releasing semiconductor packaging assembly processes.
- Equipment or prior professional ownership of DOE (Design of Experiments), SPC (Statistical Process Control), or JMP/Minitab data modeling to resolve process anomalies or optimize yields.
- Inspirational leadership with a proven talent for coaching, mentoring, and empowering engineering teams.
- Results-driven commitment to clear goal setting, structured performance management, and operational excellence.
- Strategic, analytical mindset suited for navigating complex operational challenges and influencing long-term roadmaps.
- Exceptional communication and interpersonal skills to build consensus and drive alignment across cross-functional stakeholders.
Nice to have
- 4+ years of experience in Semiconductor Assembly Process Technology Development (TD), leading processes from pathfinding through to high-volume manufacturing (HVM) transfer.
- Direct people management or formal team leadership experience, including direct ownership of performance reviews, engineering career development plans, and team resource allocation.
- Specialized Hardware Expertise with automated fluid dispense systems, thermal curing/bonding ovens, plasma treatment chambers, or optical/acoustic metrology tools.
- Documented history of influencing equipment development roadmaps or technical supplier specifications resulting in measurable cost, quality, or throughput improvements.
- Examples of leading cross-functional projects resulting in documented gains in yield, reduction in defect rates, or line throughput optimization.
Benefits
- Competitive total compensation package including competitive pay and stock bonuses.
- Comprehensive benefit programs including health, retirement, and vacation.
Job Type
Experienced Hire
- Shift: Shift 1 (United States of America)
Primary Location
US, Arizona, Phoenix (Chandler, Arizona)
Annual Salary Range
- $155,520.00 - $298,440.00 USD
Work Model
On-site presence required
About the company
Intel Corporation is a global leader in the semiconductor industry, dedicated to engineering foundational technologies that power modern computing and shape the future of innovation.
Application: UpVagas lists this opportunity from the hiring company or its recruitment platform. The application is completed at the original source.
Full listing
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