Senior Packaging Module Development Engineer
Intel
Opportunity published from Workday · applications stay with the original hiring source.
About the opportunity
Intel's Substrate Packaging Technology Development (SPTD) organization is seeking a Senior Packaging Module Development Engineer to join the team in Chandler, Arizona.
In this role, you will develop, optimize, and implement innovative processes, materials, and equipment configurations to enable next-generation IC substrate and packaging technologies.
Your work will combine physical experimentation with statistical data analytics and process modeling, directly impacting manufacturing efficiency, product quality, and reliability across Intel's advanced packaging portfolio.
Key responsibilities
- Process and material optimization to meet quality, reliability, yield, and cost targets.
- Define equipment configurations, process parameters, and integrated workflows for advanced IC substrate and packaging technologies.
- Design and execute experimental plans using Design of Experiments (DOE) principles to characterize process windows and material and equipment interactions.
- Apply statistical methods, data analytics, and engineering scripting tools to optimize manufacturing processes and resolve substrate development challenges.
- Implement continuous process improvements to enhance tool stability, product quality, and manufacturing productivity.
- Partner with cross-functional engineering, materials, and equipment teams to drive process development and root-cause troubleshooting.
- Author technical documentation, including white papers and process specifications, to enable technology transfer and knowledge sharing.
Qualifications
- Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Polymer Engineering, or related field with 6+ years of related experience; OR Master's degree with 4+ years of related experience; OR PhD with 2+ years of related experience.
- Experience with Design of Experiments (DOE), statistical data analysis, and process control tools.
- Understanding of IC substrate and/or advanced packaging processing principles.
- Experience using engineering programming tools like JMP, Python, MATLAB, or similar software for process modeling and/or data analysis.
- Technical leadership skills to guide cross-functional engineering efforts and drive technical alignment.
- Analytical mindset combining empirical data and theoretical modeling to solve complex challenges.
Nice to have
- 3+ years of experience in dielectric materials formulation and/or processing.
- Experience with Finite Element Analysis (FEA) modeling tools such as COMSOL, Ansys, or similar.
- Experience with machine learning or artificial intelligence applications for engineering scenarios.
- Experience designing experimental setups to validate modeling and simulation outputs.
Benefits
- Competitive pay and stock bonuses.
- Comprehensive health benefit programs.
- Retirement programs.
- Paid vacation.
Job Type
Experienced Hire
- Location: Chandler, Arizona (Primary Location: US, Arizona, Phoenix)
Work Model
Hybrid work model allowing split time between on-site and off-site.
Annual Salary Range
- $133,800.00 - $255,200.00 USD
- Shift: Shift 1 (United States of America)
About the company
At Intel, we create world-changing technology that improves the life of every person on the planet.
Our SPTD organization is a global leader in developing advanced substrate and packaging solutions, focusing on materials development, process optimization and simulation, and equipment advancements to power the future of computing.
Additional information
Intel is committed to ethical hiring practices. No fees are charged during the hiring process, including recruitment or medical examination fees.
Application: UpVagas lists this opportunity from the hiring company or its recruitment platform. The application is completed at the original source.
