Sort Interface Pathfinding and Development Engineer
Intel
Opportunity published from Workday · applications stay with the original hiring source.
About the opportunity
Intel Corporation is seeking a Sort Interface Pathfinding and Development Engineer to join our Sort Interface Development team in Hillsboro, Oregon.
In this role, you will pioneer breakthrough silicon interface probing and test solutions that enable best-in-class die and wafer sort capabilities across leading-edge process nodes and advanced heterogeneous packaging platforms, including EMIB, EMIB-T, Foveros, and Foveros Direct.
As Intel scales its Open System Foundry and OSAT business model, you will play an instrumental role in establishing world-class, customer-ready sort interface capabilities.
You will lead electro-mechanical pathfinding, test hardware development, customer and supplier technical co-design, and probing process qualification to support both Intel's internal product roadmap and external Foundry customers.
Key responsibilities
- Formulate and execute rigorous Design of Experiments (DOE) to optimize and qualify next-generation probing technologies and contact architectures for wafer and die sort operations.
- Serve as the lead technical liaison for Foundry and OSAT customers, translating complex chiplet and package requirements into scalable sort interface specifications.
- Author industry-standard sort design rules and Interface Design Kits (IDKs) to streamline ecosystem integration for external fabless customers and design partners.
- Collaborate with customer design and DFT teams to architect test interface hardware, resolve technical gaps, and synchronize testability roadmaps.
- Partner with global Test Solution vendors and PCB suppliers to pioneer state-of-the-art probing capabilities.
- Direct supplier and pathfinding initiatives to align vendor roadmaps with internal efficiency and performance goals.
- Drive supplier accountability and manufacturing readiness to guarantee on-time hardware delivery for critical New Product Introductions (NPI).
Qualifications
- Bachelor's degree in electrical engineering, Mechanical Engineering, Materials Science, or a related STEM field with 6+ years of industry experience; OR Master's degree in the same fields with 4+ years of industry experience; OR Ph.D. in the same fields with 2+ years of relevant post-graduate or industry experience.
- Experience with wafer/die sort technology, prober-tester cell integration, and qualification of advanced probe card technologies.
- Ability to structure and execute DOEs to evaluate probing margins, yield, and process health.
- Direct experience in ATE test hardware/methodology, Sort/Class product development, or PCB/space transformer/substrate design rules and stackup architectures.
- Strong communication, collaboration, analytical, and problem-solving skills with a customer-focused mindset.
Nice to have
- 6+ years of experience in advanced probing process characterization.
- Direct experience managing technical relationships with external probe card/substrate suppliers or providing test hardware application support to external foundry/OSAT customers.
- Knowledge of OSAT/Foundry test operations, multi-client test cell standards, customer design collateral/PDK enablement, or turnkey test delivery models.
- Experience qualifying probe technologies for fine-pitch micro-bumps, 2.5D/3D architectures (EMIB, EMIB-T, silicon bridges), or wafer-level chip-scale probing.
- Hands-on experience with commercial ATE platforms such as Advantest V93k or Teradyne Ultra-FLEX.
Benefits
- Competitive pay and annual salary range of $133,800.00 - $255,200.00 USD.
- Stock bonuses.
- Comprehensive benefit programs including health, retirement, and vacation.
Job Type
Experienced Hire
- Shift: Shift 1 (United States of America)
- Location: US, Oregon, Hillsboro
Work Model
On-site presence required
About the company
Intel Corporation is one of the world's leading semiconductor companies, driving innovation across computing, connectivity, and artificial intelligence.
Our Advanced Packaging, Test and Manufacturing (APTM) organization delivers industry-leading packaging and test technologies that power products across Client, Data Center, AI, Networking, and External Foundry markets.
Application: UpVagas lists this opportunity from the hiring company or its recruitment platform. The application is completed at the original source.
