Staff EMIB-T Substrate Yield Engineer
Intel
Opportunity published from Workday · applications stay with the original hiring source.
About the opportunity
Intel's APTM organization is seeking a highly driven Staff Technology Development Substrate Yield Lead to drive supplier yield, defect reduction, technical issue closure, and process-control maturity supporting next-generation EMIB-T substrates across Japan suppliers.
This high-visibility, high-accountability role is chartered to lead yield performance for advanced packaging technologies, including EMIB-T, partnering locally at HVM factories to enable successful technology development and manufacturing readiness across Intel Foundry Services (IFS) and Intel Product Groups (IPG).
The ideal candidate is a self-starter who thrives in ambiguous environments, proactively drives issues to closure with minimal supervision, and possesses strong technical depth, execution urgency, and the ability to influence cross-functional teams and suppliers.
This position requires an Expat assignment in Japan.
Key responsibilities
- Own day-to-day yield performance and issue closure for assigned supplier lines, modules, products, or process areas.
- Lead structured investigations from containment and hypothesis development through experiments, failure analysis, corrective action, and sustainment.
- Use statistical and spatial analytics to identify signatures by line, tool, material, panel position, geometry, product, and time.
- Establish clear supplier actions, owners, completion criteria, control limits, and verification plans.
- Support DFM/DFY, qualification, ramp readiness, change control, and deployment of dashboards or automated analytics.
- Capture reusable learning and communicate facts, hypotheses, decisions, and residual risks clearly.
- Independently manage complex technical issues, execute with urgency, and drive actions to closure.
Qualifications
- Bachelor's degree with 8+ years of experience in Engineering, Materials Science, Physics, Chemistry, Data Science, or a related technical discipline, OR Master's degree with 6+ years, OR PhD with 4+ years.
- 5+ years of experience in semiconductor manufacturing, advanced packaging, substrate technology, yield engineering, process engineering, or a closely related field.
- Hands-on experience in substrate, advanced packaging, or semiconductor yield engineering, including statistical analysis, defect reduction, process optimization, SPC, DFM/DFY, defect metrology, failure analysis, and HVM execution.
- Experience developing or deploying yield monitoring systems, automated analytics, dashboards, image analytics, computer vision, AI/ML-based defect detection, or automated defect classification systems.
- Strong analytical and problem-solving skills with the ability to make data-driven decisions in complex environments.
- Experience working across multiple organizations and influencing stakeholders to achieve results.
- This position is not eligible for Intel immigration sponsorship.
Nice to have
- Experience working directly with substrate suppliers and external manufacturing partners.
- Demonstrated program leadership experience, including coordinating cross-functional technical teams and driving execution in high-visibility environments.
- Experience with semi-additive processing, build-up films, microvias, copper plating, lithography, lamination, embedded silicon, TSV, 2.5D/3D packaging, or heterogeneous integration.
- Prior experience supporting technology development, qualification, and manufacturing ramp of advanced semiconductor technologies.
- Experience with automated data pipelines, dashboards, image analytics, computer vision, AI/ML defect detection, or automated defect classification.
Benefits
- Competitive total compensation package including base pay and stock bonuses.
- Comprehensive benefit programs including health, retirement, and vacation.
Job Type
Experienced Hire
- Shift: Shift 1 (United States of America)
Primary Location
US, Arizona, Phoenix
Additional Locations
US, New Mexico, Albuquerque; US, Oregon, Hillsboro
Annual Salary Range
- $180,770.00 - $255,200.00 USD
Work Model
Hybrid work model allowing employees to split time between working on-site at their assigned Intel site and off-site. (Subject to change).
About the company
Intel Corporation is a global technology leader, driving the digital transformation of the world's economy through data-centric innovations.
Intel designs and builds essential technologies that serve as the foundation for the world's computing devices, creating breakthrough products that advance business and society.
Additional information
Intel is committed to Responsible Business Alliance compliance and ethical hiring practices. No fees are charged during the hiring process, and candidates should never be required to pay recruitment or medical examination fees as a condition of employment.
Application: UpVagas lists this opportunity from the hiring company or its recruitment platform. The application is completed at the original source.
