TD Media and Collaterals Development Engineer
Intel
Opportunity published from Workday · applications stay with the original hiring source.
About the opportunity
As a Packaging Module Development Engineer at Intel Corporation, you will play a pivotal role in the development and optimization of assembly media and collaterals.
Your daily work will involve designing innovative solutions to improve media and collateral reliability, manufacturability, and cost efficiency, directly supporting Intel's cutting-edge assembly packaging technology roadmap and semiconductor manufacturing processes.
You will be part of Intel Corporation's Media Development organization, operating at the forefront of innovation to enable high-performance products and drive Intel's leadership in the semiconductor industry.
This on-site role offers the opportunity to contribute to transformative technology solutions within a collaborative and dynamic environment.
Key responsibilities
- Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets.
- Design and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC).
- Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces.
- Lead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods.
- Provide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones.
- Document technical improvements and innovations through research papers and presentations.
Qualifications
- Bachelor's degree in mechanical engineering or a related field with 6 months of hands-on experience.
- Experience in Equipment Engineering, Mechanical Design, and/or Process Engineering.
- Strong technical and analytical skills, with a proven ability to deliver results on complex, time-critical projects.
- Note: This position is not eligible for Intel immigration sponsorship.
Nice to have
- Experience with mechanical design software such as SolidWorks or AutoCAD.
- Portfolio showcasing self-completed projects from concept to fabrication.
- Familiarity with semiconductor packaging processes and technology.
Benefits
- Competitive annual salary range of $85,200.00-120,280.00 USD.
- Comprehensive total compensation package including stock bonuses.
- Health, retirement, and vacation benefit programs.
Job Type
Experienced Hire
- Shift: Shift 1 (United States of America)
Primary Location
US, Arizona, Phoenix
Work Model
On-site presence required (subject to change)
About the company
Intel Corporation is a global leader dedicated to advancing packaging technologies and manufacturing processes, enabling high-performance products, and driving semiconductor industry leadership.
Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices.
Additional information
Intel does not charge any fees during our hiring process. Candidates are never required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment.
Application: UpVagas lists this opportunity from the hiring company or its recruitment platform. The application is completed at the original source.
