Thermal Engineering Program Manager
NVIDIA
Opportunity published from Workday · applications stay with the original hiring source.
About the opportunity
NVIDIA is looking for a Thermal Engineering Program Manager to support the engineers developing thermal solutions for our next generation of products.
Our thermal team works across data center, automotive, robotics, and gaming products, translating thermal technologies into designs from package to system level.
In this role, you will manage the cross-functional plans and dependencies that enable thermal design and validation from early product definition through production release.
Working alongside thermal engineers and partner teams, you will secure critical resources, resolve program blockers, and help engineers focus on design, analysis, and testing.
Key responsibilities
- Lead thermal engineering program planning from pre-silicon development through silicon bring-up, qualification, and production release.
- Drive priorities thermal qualification dependencies and deliverables to achieve schedule and scope targets, and proactively elevate risks and obstacles.
- Coordinate thermal qualification and reliability activities with engineering, packaging, reliability, operations, and suppliers.
- Track prototype and sample needs, test prerequisites, data delivery, and issue resolution to support product readiness decisions.
- Run multi-disciplinary program reviews, drive follow-through, and communicate status and risks to engineering teams and leadership.
- Continuously improve product quality and development schedule by maintaining a high bar for thermal execution and striving for new efficiencies.
Qualifications
- BS degree or greater in an engineering field (or equivalent experience), mechanical focus preferred.
- 4+ yrs of working experience, preferably in a hardware program management role.
- Hands on experience with hardware product development.
- Strong project/program management fundamentals.
- Culture of continuous learning, ongoing process improvement, and a first-principles approach to problem-solving.
- Experience in influencing decisions and leading teams in a matrixed environment.
Nice to have
- Working knowledge of electronics thermal development and the dependencies between silicon, packaging, hardware, firmware, software, and product qualification.
- Familiarity with thermal testing, electronics cooling, package mechanics, thermal interface materials, and reliability qualification.
- Experience coordinating silicon bring-up and thermal validation, including dependencies on BIOS, firmware, software, and voltage and frequency settings.
- PM Certification/training a plus, not required.
Benefits
- Base salary range of 136,000 USD – 212,750 USD, determined based on location, experience, and other objective job-related factors.
- Eligible for equity and benefits.
Job details
- Applications accepted at least until November 17, 2026.
- Posting for an existing vacancy.
About the company
VIDIA is a pioneer in GPU-accelerated computing, transforming industries such as gaming, data centers, automotive, and robotics. We foster an innovative, inclusive work environment and leverage advanced tools and technologies to drive the future of computing.
Additional information
NVIDIA uses AI tools in its recruiting processes.
Application: UpVagas lists this opportunity from the hiring company or its recruitment platform. The application is completed at the original source.
