WPM NM C4 Electroplating Module Engineer
Intel
Opportunity published from Workday · applications stay with the original hiring source.
About the opportunity
As a Module Engineer at Intel, you will play a key role in optimizing and maintaining critical high-volume manufacturing processes essential to producing cutting-edge semiconductor products.
This hands-on role focuses on ensuring equipment reliability, process efficiency, and product quality.
You will join Intel's Wafer Packaging Manufacturing organization, a team dedicated to delivering innovation and operational excellence in high-volume production environments.
This group plays a central role in Intel's advanced packaging strategy, which is critical for fabricating high-performance chips like next-generation AI processors.
Key responsibilities
- Develop, monitor, and optimize manufacturing processes to ensure operational reliability and product quality.
- Conduct tests and measurements to control critical dimensions and defectivity within production lines.
- Analyze and address process excursions to enhance efficiency and minimize production disruptions.
- Collaborate with cross-functional teams to drive manufacturability improvements and process enhancements.
- Apply Statistical Process Control and Design of Experiments methodologies to refine processes and improve yield.
- Perform maintenance, repair, and optimization activities for manufacturing tools and components.
- Partner with equipment suppliers to resolve operational issues and implement technological advancements.
- Oversee equipment installation, conversion, and qualification during factory ramps, meeting safety and quality standards.
Qualifications
- Bachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline with 2+ years of relevant experience in manufacturing process or equipment engineering, OR Master's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline.
- Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience.
Nice to have
- Experience in Semiconductor Manufacturing or Semiconductor Packaging Manufacturing.
- Experience with Statistical Process Control, Metrology tool recipe creation, and tool troubleshooting.
Benefits
- Competitive pay including stock bonuses.
- Comprehensive benefit programs including health, retirement, and vacation.
Annual Salary Range
- $89,010.00-146,440.00 USD
Job Type
College Grad
- Shift: Shift 1 (United States of America)
Primary Location
US, New Mexico, Albuquerque
Work Model
Hybrid (allows employees to split time between working on-site at their assigned Intel site and off-site)
About the company
Intel Corporation is an industry leader in computing innovation, designing and building the essential technologies that serve as the foundation for the world's computing devices.
Intel's advanced manufacturing and packaging operations drive the creation of high-performance processors and semiconductor solutions that shape the future of technology.
Additional information
- Intel does not charge any fees during its hiring process. Candidates are never required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment.
Application: UpVagas lists this opportunity from the hiring company or its recruitment platform. The application is completed at the original source.
